PRODUCT DESCRIPTION
Chip Molding Machine



Features

● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;

● Full servo control system, PLC (Omron) + controller;

● CCD image detection, feeding anti-reverse detection;

● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;

● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;

● Customized on demand, permanently provide quality service.



Customization:
TJIN Semiconductor Molding Machine - Customized Service
Brand Name: TJIN

Model Number: 001

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Product Attributes:
Auto Transfer Molding
Auto Packaging Equipment
Auto Packaging Equipment
Injection Unit: Single
Max. Mold Height: 400 Mm
Screw Diameter: 35 Mm
Cooling System: Water
Control System: PLC
Packing and Shipping:
Product Name: Semiconductor Molding Machine
Packaging and Shipping:
Each unit is packaged in a sturdy cardboard box to ensure safe transportation.
The packaging also includes foam inserts to protect the delicate components of the machine.
For international shipping, the machine will be packed in a wooden crate for extra protection.
The package will be labeled with the product name, model number, and any necessary handling instructions.
For domestic shipping, the machine will be shipped via a trusted courier service with tracking information provided.
International shipping will be arranged through a reputable freight forwarder to ensure timely and secure delivery.


Technical Parameters:
Technical Parameters Value
Screw Diameter 35 mm
Model SM-1000
Clamping Force 1000 KN
Platen Size 600 x 600 mm
Cooling System Water
Max. Mold Height 400 mm
Capacity 100 tons
Type Vertical Injection Molding Machine
Injection Pressure 200 MPa
Heating Power 12 KW
Product Features Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging


Performance Parameters

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).



FAQ:
Q: What is the brand name of this product?
A: The brand name is TJIN.
Q: What is the model number of this product?
A: The model number is 001.
Q: Where is this product manufactured?
A: This product is manufactured in China.
Q: Does this product have any certifications?
A: Yes, it is certified with ISO9001.
Q: What is the minimum order quantity for this product?
A: The minimum order quantity is 1.
Q: How is this product packaged?
A: It is packaged in wooden packaging.
Q: What is the estimated delivery time for this product?
A: The estimated delivery time is 40 days.
Q: What are the accepted payment terms for this product?
A: The accepted payment terms are TT (telegraphic transfer).