CY-MSP210S-RFD desktop dual-target magnetron sputtering coating instrument. The equipment has been miniaturized, while retaining the high-vacuum stainless steel cavity, while simplifying other mechanisms, limiting the shape of the equipment to the desktop level, greatly reducing the installation site requirements. The equipment is equipped with a DC power supply and an RF power supply. The DC target can be used for sputtering of metals and other conductive materials. The RF power supply can be used for sputtering of various non-metals and metal oxides. The equipment vacuum system adopts all imported vacuum pumps, with fast pumping speed, high ultimate vacuum and excellent vacuum performance. The equipment has compact structure, perfect functions and easy to use. It is very suitable for various coating tests.
Technical parameter:
Sample stage
size φ150mm heating Up to 500℃
Rotating speed 0-20 adjustable
Magnetron sputtering target Quantity 2” x2 dual targets share a baffle
Vacuum chamber Cavity size φ210mm X 230mm Observation window φ40mm
Cavity material SS304 stainless steel Opening method Front door
Vacuum system Mechanical pump Imported oil-free diaphragm pump Pumping interface KF16
Molecular pump Imported molecular pump Pumping interface KF40
Vacuum measurement Resistance gauge + ionization gauge Exhaust interface KF16
Ultimate vacuum 1.0E-3Pa Power supply AC 220V 50/60Hz
Pumping rate Oil-free pump 0.49L/s Molecular pump: 40L/S
Vacuum system Quantity DC power supply x1 RF power supply x1 Maximum output power DC power supply 500W RF power supply 500W

other Supply voltage AC220V, 50Hz Overall size 550mm X 550mm X1100mm
Total power 2kW