sputtering coater (for depositing aluminum)
This equipment is a desktop single sputter head magnetron sputtering coating machine. The miniaturized design of the equipment limits the appearance of the equipment to the desktop level, greatly reducing the installation site requirements. The equipment is equipped with a high-performance DC power supply with target refining function, which can effectively remove the oxide layer on the surface of the aluminum target. It is very suitable for aluminum plating and other materials that are very sensitive to air. This equipment has compact structure and perfect function and is easy to use, and is very suitable for various coating tests.
Technical parameters:
Sample stage Size φ100mm
Rotating speed 0-20rpm adjustable
Heating Max. 500℃
Magnetron sputtering head Quantity 2" x1
Vacuum chamber Chamber size φ180mm x 215mm
Observation window Omnidirectional transparent
Chamber material High purity quartz
Open method Upper cover removable
Vacuum system Mechanical pump Rotary vane pump
Pumping port KF16
Exhaust interface KF16
Molecular pump Turbomolecular pump
Pumping port KF40
Exhaust interface KF40
Vacuum measurement Resistance gauge + ionization gauge
Ultimate vacuum 1.0E-4Pa
Power supply AC 220V 50/60Hz
Pumping rate Mechanical pump 1.1L/s Molecular pump 600L/s
Power configuration Quantity DC power supply x1
Max. output power DC power supply 500W
Supply voltage AC220V, 50Hz
Others Total power 2kW
Overall size 550mm x 350mm x 500mm