Thru Hole SMT OSP FR4 Electronics Automotive PCB Assembly
PCB Assembly Introduction
For Turnkey PCB Assembly, all you need to do is to send us your PCB assembly Bill of Materials (BOM) list. ( a document or a spreadsheet format containing the PCB specification selection ), the number of layers, quantity, and a
For Turnkey PCB Assembly, all you need to do is to send us your PCB assembly Bill of Materials (BOM) list. ( a document or a spreadsheet format containing the PCB specification selection ), the number of layers, quantity, and a
PCB Assembly Introduction
For Turnkey PCB Assembly, all you need to do is to send us your PCB assembly Bill of Materials (BOM) list. ( a document or a spreadsheet format containing the PCB specification selection ), the number of layers, quantity, and all dimensions necessary. In addition, you also need to include a CAD-generated Gerber or Centroid file for the top/bottom copper, Silkscreen and other details.
Next, we will send a formal quote for your order approval before production . you can fix it if there’s any problem .
A summary of the process for a turnkey PCB assembly order :
Place Order
Component procurement
PCB Design
PCB Assembly
Quality assurance and testing
Prototyping
Packing
Shipping
Aftersales services and support
PCB CAPABILITIES
FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size
Laser 0.075mm
Mechnical 0.15
Laser 0.05mm
Mechnical 0.15
5 Min Line Width/Space 0.035mm/0.035 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
For Turnkey PCB Assembly, all you need to do is to send us your PCB assembly Bill of Materials (BOM) list. ( a document or a spreadsheet format containing the PCB specification selection ), the number of layers, quantity, and all dimensions necessary. In addition, you also need to include a CAD-generated Gerber or Centroid file for the top/bottom copper, Silkscreen and other details.
Next, we will send a formal quote for your order approval before production . you can fix it if there’s any problem .
A summary of the process for a turnkey PCB assembly order :
Place Order
Component procurement
PCB Design
PCB Assembly
Quality assurance and testing
Prototyping
Packing
Shipping
Aftersales services and support
PCB CAPABILITIES
FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size
Laser 0.075mm
Mechnical 0.15
Laser 0.05mm
Mechnical 0.15
5 Min Line Width/Space 0.035mm/0.035 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI